Etched IC Lead Frame
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- 产品描述
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Product Description
This etched IC lead frame acts as the carrier for integrated circuit chips, connecting internal chip circuits with external leads to form a complete electrical loop. Manufactured by high-precision chemical etching technology, it adopts partial silver plating instead of full silver plating to greatly reduce raw material costs. Various pin counts, base materials and thicknesses are available for customization.
Application Scenarios
Suitable for packaging of power management ICs, automotive control chips, driver ICs, consumer electronics semiconductors and industrial control chips.
Core Specs
- Pin count: 6L/7L/8L/9L/10L/12L/14L/16L/18L/20L/24L/28L
- Rows layout: 1R/2R/3R/4R/5R
- Raw material: NI42, A194, C7025, SPCC, KFC
- Thickness: 0.127mm / 0.152mm / 0.203mm / 0.254mm
- Surface treatment: Partial silver plating
Etched IC Lead Frame
If you need customized products, Contact US !
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